Large-area precision equipment for Glass/film processing using scanners and stages
Machine Key Specification
| Material | Substrate | Films / PCB / Glass / any sheet type subst. | |
|---|---|---|---|
| Std. Substrate Size | 500mm x 500mm (TBD) (not limited in work size) | ||
| System | Std. System Size | 2,500(W) * 2,600(D) * 1,600(H) (TBD) | |
| System Weight | Approx. 2,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Cutting Station | Pin Hole with Vacuum or Porous | ||
| Stage Flatness | ± 25um | ||
| Max Cutting Speed | >200mm/s | ||
| Laser Cutting Accuracy | ≤ ±10um | ||
| Vision Align |
Camera | 1024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| ESD | CDA – Air blow, Anti-ESD coating material | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
※ The above specification is changed at the request of the customer.