Marking (Cutting/Patterning) device using various lasers
- Easy maintenance and operation
- Remote control interfaces
- Applicable to various wavelengths/types of laser Optimized for various material conditions
- Continuous upgrade support
Machine Key Specification
| Material | Substrate | Films / PCB / Glass / food container / any sheet type subst. | |
|---|---|---|---|
| Std. Substrate Size | 200 * 200mm (TBD) | ||
| System | Std. System Size | 2,100(W) * 1,800(D) * 2,200(H) (TBD) | |
| System Weight | Approx. 2,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Cutting Station | Pin Hole with Vacuum | ||
| Stage Flatness | ± 100um | ||
| Max Marking Speed | 500mm/s | ||
| Laser Marking Accuracy | ± 100um | ||
| Water and dust IP ratings | IP 67 / 66 (option)_Laser Head | ||
| Vision Align |
Camera | 1024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
※ The above specification is changed at the request of the customer.