Cutting equipment using a laser after lamination of film on wafer
- Free Tension Lamination of Wafer Back Grinding Film
- Laser cutting of film - Offset can be set freely from the wafer edge
Machine Key Specification
| Material | Substrate | Films / PCB / Glass / any sheet type subst. | |
|---|---|---|---|
| Std. Substrate Size | 8”~12” Wafer | ||
| System | Std. System Size | 2,500(W) * 2,600(D) * 1,600(H) (TBD) | |
| System Weight | Approx. 3,500kg | ||
| System Pass Line | 800mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Movement method | Roll to Roll | ||
| Stage Flatness | ± 25um | ||
| Max Process Speed | >200mm/s | ||
| Laser Cutting Accuracy | ≤ ±10um | ||
| Vision Align |
Camera | 1024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
※ The above specification is changed at the request of the customer.