Peel off the Au and Ni layers of the connector using a laser (with roll to roll logistics)
- Optimized Optical system for Peel Off : Long DOF optical system / Co-axial Vision with Fiber opitcs
- Fully automated line system with articulated robot Arms
Machine Key Specification
| Material | Substrate | Metal material (TBD) | |
|---|---|---|---|
| Std. Substrate Size | 400mm x 500mm (TBD) (not limited in work size) | ||
| System | Std. System Size | 2,820(W) * 1,100(D) * 1,956(H) (TBD) | |
| System Weight | Approx. 3,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Movement method | Roll to Roll | ||
| RTR Flatness | ± 200um | ||
| Max Process Speed | 100mm/s | ||
| Process Width | 50~200㎛ | ||
| Vision Align |
Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
※ The above specification is changed at the request of the customer.